We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Circuit Board Processing.
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Circuit Board Processing Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

Circuit Board Processing Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. 本沢プリント工業 Ibaraki//Machine elements and parts
  2. HiPA Photonics Japan Kanagawa//Trading company/Wholesale
  3. 21あおもり産業総合支援センター Aomori//Public interest/special/independent administrative agency
  4. 4 ミツル光学研究所 Kanagawa//Glass and clay products
  5. 5 武蔵野ファインガラス Saitama//Manufacturing and processing contract
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Circuit Board Processing Product ranking

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. Honzawa Print Industry Co., Ltd. Business Introduction 本沢プリント工業
  2. Laser scribe alumina substrate processing HiPA Photonics Japan
  3. Mikawa Manufacturing Co., Ltd. 21あおもり産業総合支援センター
  4. 4 Processing of support substrates for semiconductor wafers 武蔵野ファインガラス
  5. 4 LCD glass substrate processing ミツル光学研究所

Circuit Board Processing Product List

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High-frequency applications processing of PTFE substrates

High-frequency applications processing of PTFE substrates

Introducing processing of PTEF substrates for high-frequency applications!

This is an introduction to the processing of PTFE substrates by the American company Polifron, which has contributed to the electronics industry for many years through a wide range of products that fully utilize the unique properties of TEF resin. 【Features】 ○ Processing into any shape is possible ○ Generates high performance, turning engineers' ideals into reality ○ Optimal as a low-loss high-frequency substrate in the microwave/millimeter-wave field ● For other functions and details, please download the catalog.

  • Processing Contract

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Honzawa Print Industry Co., Ltd. Business Introduction

Honzawa Print Industry Co., Ltd. Business Introduction

We will respond flexibly according to your consultation!

Our company specializes in secondary processing of printed circuit boards. In addition to visual inspection of printed circuit boards using magnifying glasses and stereo microscopes, we also perform routing, press punching, and assembly. Furthermore, we are capable of handling not only the above-mentioned tasks but also assembly finishing of CDs and DVDs, as well as inspection and finishing of precision metal parts for automobiles. 【Features】 ■ Not only visual inspection but also finishing processing and assembly ■ Flexible response according to consultation ■ Authorized for general staffing services *Please feel free to contact us for more details.

  • Contract Inspection
  • Other Auto Parts
  • Printed Circuit Board

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Through-hole electrode glass substrate processing

Through-hole electrode glass substrate processing

The adoption of ultra-small diameter electrodes and the ability to accommodate extremely narrow pitch electrode pins are also possible! Dimensional accuracy is extremely high.

We would like to introduce our "through-electrode glass substrate processing." This technology applies the sealing technology of CCFL, ensuring high airtightness, and allows for the adoption of ultra-small diameter electrodes and extremely narrow pitch for electrode pins to accommodate miniaturization. Additionally, through years of research on glass sealing conditions, the dimensional accuracy of the electrode pin pitch has achieved extremely high precision. 【Features】 ■ Glass substrate with through electrodes ■ Application of CCFL sealing technology ■ Possible adoption of ultra-small diameter electrodes and extremely narrow pitch for electrode pins *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Processing of support substrates for semiconductor wafers

Processing of support substrates for semiconductor wafers

Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.

At Musashino Fine Glass, we accept processing of support substrates for semiconductor wafers. We offer substrates made of borosilicate glass, non-acrylic glass, and quartz glass. Rectangular substrates can be processed up to a maximum size of 370×470mm, and circular substrates up to a maximum diameter of φ300mm, with processing methods available for sizes as small as 10mm square. During the prototype development phase, we can process from just one piece, so please feel free to consult with us when needed. 【Processing Overview】 ■ Processing Substrates: Borosilicate glass, non-acrylic glass, quartz glass ■ Processing Sizes: Maximum rectangular size 370×470mm, maximum circular size φ300mm (minimum size available upon consultation) ■ Thickness Accuracy: TTV≦1μm is possible ■ Processing Quantity: Processing from one piece during prototype development, mass production is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Circuit board design and manufacturing
  • Other semiconductors

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LCD glass substrate processing

LCD glass substrate processing

From procurement to shipping tailored to customer needs! Also compatible with R corner cuts!

At Mitsuru Optical Research Institute Co., Ltd., we provide "LCD glass substrate processing" tailored to our customers' needs. We cut, chamfer, and polish materials sourced from various glass manufacturers according to customer specifications, and we transport them to designated locations nationwide in the specified packaging format. For chamfering, we also accommodate R corner cuts and R chamfer shapes to enhance glass strength. 【Features】 ■ Capable of handling sizes up to 1500×1500 for cutting only ■ Supports cutting of color filters and pre-coated substrates ■ Capable of re-chamfering and resizing glass using large NC machines ■ Conducts sampling inspections based on shipping lot numbers at the time of final shipment ■ Equipped with measurement instruments such as optical microscopes and SEM-EDX *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board processing machine
  • Other processing machines

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Break device for wafer and substrate processing

Break device for wafer and substrate processing

Introducing a break device compatible with 6-inch wafers! By exchanging the blade and table, it can accommodate wafers from 2 inches to 4 inches.

By using double-arm transport, we shorten the loading time of wafers. Additionally, by improving visibility, we reduce matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Improved throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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[Example] Product Processing

[Example] Product Processing

Examples of processing products made with precise technology, such as ceramic substrates and alumina substrates!

We would like to introduce examples of product processing created with our precise technology. Notable examples of product processing include silicon nitride substrate processing and hole enlargement. In addition to ceramic substrates, we can also accommodate materials such as sapphire, quartz, and zirconia. Please feel free to consult with us. 【Main Product Processing Examples】 ■ Silicon Nitride Substrate Processing ■ Hole Enlargement *For more details, please refer to the related links or feel free to contact us.

  • Processing Contract

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Laser scribe alumina substrate processing

Laser scribe alumina substrate processing

You can utilize it as a laser scriber capable of scribing electronic component substrates and ceramic substrates!

Product Features Good laser stability and prompt after-sales service Customizable in-house software, process diagrams, and process parameters [Features] ■ High-precision motion control positioning at 1μm, PSO designated jump function ■ Customizable production platform, compatible with various substrate sizes (50mm×60mm to 80mm×84mm) ■ Achieves ±0.75μm/70mm straightness and ±1μm positioning accuracy through collaboration of in-house designed machine systems and vision systems ■ High-speed scribing efficiency, 6070 size, 0201 standard, total efficiency of scribing one front and back surface in 200 seconds *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Mikawa Manufacturing Co., Ltd.

Mikawa Manufacturing Co., Ltd.

Creating the future through precision machining: Maximizing the potential of electronic devices and plastics.

Processing details, main products and technology features: Electrical assembly, electrical wiring. Optical terminal processing, sensor mat manufacturing, printed circuit board/FPC board processing. We have strengths in soldering work, with many professionals skilled in component retrofitting and modifications. Additionally, we have introduced CNC lathes, enabling us to handle cutting processing of plastic products as well.

  • others

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Scribe device wafer substrate processing

Scribe device wafer substrate processing

High speed, high quality! This is a semi-automatic scriber compatible with 4-inch wafers.

This is a semi-automatic scribing device compatible with 4-inch wafers, featuring independent processing axis, feed axis, and camera axis. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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